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Advanced Packaging Solution by advanced-packaging.info

Datacon Research Technology

Welcome to official website of Datacon Technology AG. We are an internationally operating group of companies which develops and produces high-precision machines for the semiconductor industry and thus supplies leading microelectronics companies across the globe. Datacon – your essential technology partner for semiconductor production equipment.
With 450 staff under the umbrella of Datacon Technology AG, 110 of whom work in Research and Development. Datacon has concentrated on the advanced packaging market since 1986, focusing on die bonding and flip chip technologies. Datacon leads the way in these markets, guaranteeing our customers a future-oriented, customized solution. Don't be content with anything else!
Our complete team believes in its vision of to successfully contribute to the advancement of microelectronics by addressing and implementing the current and future requirements of the fast-moving Advanced Packaging Market. Be a part of us.

Advanced Packaging Solution by advanced-packaging.info

Advanced Packaging Solution by advanced-packaging.info
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