Advanced-Chip-to-Wafer Technology Datacon’s leadership in advanced packaging technology, combined with EVG´s wafer-to-wafer bonding experience results in a unique assembly line.
Advanced-chip-to-wafer-technology can generate packages that are an alternative to expensive embedded processes. It saves device manufacturers time and money by combining highest throughput and utilization of well established flip-chip and die attach processes with the permanent bonding process under well-controlled process parameters.
A continuous demand for electronic devices with more advanced functionality, in addition to decreased size and weight calls for ever-increasing integration and complexity. 3D system integration using chip-to-wafer technology offers the highest integration and performance of chip technology in combination with the flexibility and time-to-market advantages of packaging technology. Fundamental benefits of Advanced-Chip-to-Wafer technology are the possibility to combine chips from a broad range of process technologies and wafer sizes and the integration of multiple, different-sized chips onto a single base chip. Datacon Flip Chip Bonder by flip-chip-bonder.net |
